Winbond Electronics Corporation
Long-term stable supply achieved by owning our own fabs! Winbond, a total memory solution provider.
Winbond stands out as one of the few companies worldwide with proprietary products and technology in both memory and logic integrated circuits. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total integrated circuits solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash, Customized Memory Solution (CMS), and various Logic IC solutions. At EdgeTech+, we will exhibit demonstrations of each product and explain product features.
Products & Services
CMS
At CMS, our mission goes beyond manufacturing with renewable energy. We prioritize understanding customer needs, addressing system-level challenges, and continuously innovating to develop products that minimize energy consumption.
CMS specializes in delivering memory solutions tailored to the unique demands of enterprises. Each solution is carefully designed and optimized for specific applications or environments, ensuring exceptional performance, reliability, and cost-efficiency.
<Memory Capacity and Speed>
Designing memory modules with the appropriate capacity and speed to meet specific application requirements.
< Memory Types>
Providing a range of memory options, such as DDR4 and LPDDR4, to suit various requirements.
Code Storage Flash Memory
As a leading global supplier of semiconductor memory solutions, Winbond offers a comprehensive portfolio of Code Storage Flash, including NOR Flash, NAND Flash, and TrustME® Secure Flash. Our products are engineered for high performance, low power consumption, and space-efficient packaging, offering a wide range of densities to meet diverse design requirements. This makes them the ideal choice for automotive, industrial, and consumer electronics across a broad range of applications.
＜Line-up＞
TrustME Secure Flash
QSPI NOR
Octal NOR
Authentication
QSPI NAND
Octal NAND
ONFI NAND
MCP
SpiStack Combo Flash
Related Videos
CUBE: Powering the Next Generation of Edge AI Devices
From smart cameras and autonomous vehicles to industrial robots, Edge AI is rapidly expanding across real-world applications. As devices become smaller, battery-powered, and deployed at scale, they place unprecedented demands on memory performance, power efficiency, and system design. To meet these challenges, Winbond introduces CUBE — a purpose-built memory solution designed to power the next generation of edge AI devices, combining high-bandwidth performance, ultra-low power consumption, and a compact 3D-stacked architecture in one integrated design.
Memory Solution for AI
The AI era has truly arrived. From IoT to edge computing, next-generation memory solutions are essential to process and store massive amounts of data efficiently. Winbond offers a comprehensive portfolio of AI-focused memory products, including high-bandwidth, low-power CUBE and GP-Boost DRAM, compact HYPERRAM™ for embedded AI applications, and high-speed flash memory solutions delivering read throughput of up to 240 MB/s for automotive and industrial systems. In addition, Winbond’s TrustME® Secure Flash provides secure boot, safe OTA updates, and robust data protection capabilities to safeguard AI and AIoT devices against cyber threats. Discover how Winbond’s innovative memory technologies are powering the future of AI by watching our video.
Automotive Solution
Winbond provides high-quality, high-performance automotive-grade memory solutions. Its product lineup includes mobile DRAM, specialty DRAM, code storage flash, and TrustME secure flash. In addition, these products are available in a wide range of capacities and package options. Winbond’s diverse solutions meet all the requirements of innovative new automotive applications.