In recent years, signal transmission speeds in embedded boards for industrial applications have continued to increase, driven by the widespread use of high-speed SDRAMs ranging from DDR3 to DDR5 and LPDDR5, as well as high-speed NRZ and PAM4 serial transmission exceeding 10 Gbps. In addition, as semiconductor devices continue to operate at lower voltages and higher currents, more advanced PCB design technologies are required than ever before.
This presentation explains key considerations for material selection, layer stack-up, and routing design of high-speed digital PCBs, as well as simulation-based verification methods, using our measurement results and design examples. Attendees will learn how to effectively utilize simulation during the design phase to identify potential issues early and reduce design rework.